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Jiangsu Meikang solar panel case

Hits:134 comment:0 Date:2016/11/21 9:33:17 tags:全部

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Slicing, cleaning, preparing suede, peripheral etching, remove the back of the PN+ junction, making the upper and lower electrodes, the production of antireflection coating, sintering, testing and other 10 steps.

Solar cell specific production process description

(1) slice: the silicon rod is cut into a square silicon wafer by multi wire cutting.

(2) cleaning: cleaning with a conventional silicon wafer cleaning method, and then using the acid (or alkali) solution to remove the surface of the silicon wafer to remove the damage layer 30 - 50um.

(3) preparation of the surface: the anisotropic etching of silicon wafer with alkali solution was used to prepare the surface of silicon wafer.

(4) phosphorus diffusion: the use of coating source (or liquid source, or solid phosphorus nitride sheet source) diffusion, made of PN+ junction, junction depth is generally 0.3 - 0.5um.

(5) peripheral etching: diffusion layer formed on the surface of silicon wafer during diffusion, which can make the upper and lower electrodes of the battery short circuit, and remove the surrounding diffusion layer by masking wet etching or plasma dry etching.

(6) remove the back PN+ junction. The commonly used wet etching or grinding method to remove the back of the PN+.

(7) the upper and lower electrodes were fabricated by vacuum evaporation, chemical nickel plating or aluminum paste printing and sintering. The first electrode is fabricated, and then the upper electrode is made. Aluminum paste printing is a large number of technical methods.

(8) to make the antireflection film: in order to reduce the loss of reflection, it is necessary to cover a layer of antireflection coating on the surface of the silicon wafer. The materials used to make antireflection coatings are MgF2, SiO2, Al2O3, SiO, Si3N4, TiO2, Ta2O5, etc.. The method can be used in vacuum coating, ion plating, sputtering, printing, PECVD or spraying.

(9) sintering: sintering a battery chip onto a nickel or copper substrate.

(10) test sub files: according to the provisions of the parameter specification, test classification.


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